8"
Reclaim Wafer Specifications
| Particles: |
|
| |
< 10
counts @> 0.3 micro m |
| |
< 20
counts @> 0.2 micro m |
| Flatness: |
|
| |
TTV<
15 micro m |
| |
Warp<
50 micro m |
| Metals: |
|
| |
< 5E10 |
(1)
LAPPING
Double Side Lapping
Machine
Low Depth of Surface Damage
(2)
POLISHING
Integrated Single-Side
Polisher
| Typical
Results: |
|
| TTV <
2.5 micro m |
TIR< 1.6 micro m |
| STIR <
0.25 micro m |
SFPD< 0.16 micro m |
(3)
CLEANING
Completed Automated
Processes
(4)
QUALITY ASSURANCE
Noncontact Flatness
Measurement
Excellent Accuracy & Precision
10nm Resolution |
|
