MOSPEC SEMICONDUCTOR
ISO 9001 / ISO 14001  
 

Reliability Test Program


Reliability Test Program


The reliability life test is performed periodically to insure that the entire manufacturing process is running properly.

NO.
TEST ITEM
TEST CONDITION
DURATION
REFERENCE DOCUMENT
1 SOLDERABILITY 2300C ~ 2600C 5SEC 1 TIME MIL-STD-750B
METHOD 2062.3
2 LEAD TENSION 2KG IN LEAD DIRECTION 10SEC MIL-STD-750B
METHOD 2036.3
3 LEAD FATIGUE 900C BEND WITH 0.5KG WEIGHT
ATTACHED TO LEAD
3 TIMES MIL-STD-750B
METHOD 2036.3
4 LEAD TORQUE 1.45+-0.145KG-MM 1 TIME MIL-STD-750B
METHOD 2036.3
5 OPERATING LIFE RATED VOLTAGE & CURRENT
@250C
168/1000HRS MIL-STD-750B
METHOD 1027.1
6 HIGH
TEMPERATURE
REVERSE BIAS
80% RATED VOLTAGE@1500C 168/1000HRS MIL-STD-750B
METHOD 1039
7 INTERMITTENT
OPERATING LIFE
ON-WITH RATED IC,IB
OFF-WITH COOL FORCE FAN
Tc=60 - 700C
1000CYCLES MIL-STD-750B
METHOD 1036.3
8 HIGH
TEMPERATURE
STORAGE LIFE
@1500C 168/1000HRS MIL-STD-750B
METHOD 1031.4
9 MOISTURE
RESISTANCE
850C/85%RH 168/1000HRS MIL-STD-750B
METHOD 1021.1
10 PRESSURE COOK 119.60C/2ATM 48/144HRS MIL-S-19500
APPENDIX C
11 THERMAL SHOCK -400c/5MIN ~ 1500C/5MIN
250C/10SEC FOR TRANSFER
50/100CYCLES MIL-STD-750B
METHOD 1056.1
12 TEMPERATURE
CYCLING
-650C/30MIN ~ 1500C/30MIN
250C/10MIN FOR TRANSFER
50/100CYCLES MIL-STD-750B
METHOD 1051.2
13 SOLDERING HEAT 2600C +-50C 10SEC 1TIME MIL-STD-750B
METHOD 2031.1
14 SALT SPRAY 5% SALT SOLUTION UNDER
350C AIR/470C CHAMBER
48HRS MIL-STD-750B
METHOD 1046.2

*Tc=Case Temperature